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FLEX Taiwan 2019 Opens Tomorrow – Flexible Hybrid Electronics Innovations, Opportunities, Growth in Spotlight

Hsinchu, Taiwan — May 28, 2019 — The latest trends and opportunities in flexible hybrid electronics (FHE) take the spotlight at FLEX Taiwan 2019 starting tomorrow as industry experts and leaders gather to provide insights into flexible chips and batteries, Smart clothing, e-wear, precision sports and other flexible electronics innovations. May 29-30 at the Taipei International Convention Center (TICC), FLEX Taiwan 2019 also highlights the latest advances in flexible electronics manufacturing technology.

Flex Taiwan 2019 banner

Organized by SEMI-FlexTech, a SEMI Strategic Association Partner,
FLEX Taiwan 2019 will feature presentations by the following industry thought leaders on opening day. For the full speaker lineup, please see the agenda.

Flexible Hybrid Electronics Applications

Satoshi Maeda Photo

Satoshi Maeda, Senior Coordinator – Development and International Standardization of Garment Type Wearable Devices

Toyobo Logo
 Reinhold H Dauskardt Photo

Reinhold H. Dauskardt, Professor – Human Skin: the “Seam” between Our Body and e-Wear Technologies

Stanford University Logo
Gillian Ewers Photo

Gillian Ewers, VP Marketing – Roadmap to Trillions of Smart Objects

Pragmantic logo

Flexible Hybrid Electronics Manufacturing

Dr. Vincent Lin

Dr. Vincent Lin, Director, Corporate R&D/Technology Development – New Generation RF & Si-Photonic Packaging Technologies

ASE English Logo
Stan Yang Photo

Stan Yang, Regional Sales, Head-China & Taiwan Flexible Technology Group – Flexible Manufacturing Technologies

Applied Materials Color Logo

The global flexible electronics market is expected to be a major growth driver for the microelectronics industry. Powering this rapid expansion are key application areas including wearables, robotics, telematics and industrial automation. Flexible electronics are inspiring innovative solutions across agriculture, the environment, healthcare, transportation and other key areas to advance social good by combining high-performance semiconductor components with the lightness, scalability, softness and flexibility typical of printed electronics.

“Taiwan is a leader in the global microelectronics industry with cutting-edge manufacturing technologies and the densest semiconductor device supply chain community in the world,” said Terry Tsao, Global Chief Marketing Officer and president of SEMI Taiwan. “With its premier semiconductor and display manufacturing technologies, Taiwan is in a strong position to drive FHE innovation. SEMI-FlexTech complements Taiwan’s technology prowess, providing a key platform for promoting FHE collaboration and technology development across the industry to help drive growth.”

For the past 18 years, SEMI and FlexTech have championed the development of the FHE industry through conferences and exhibitions in major microelectronics manufacturing regions such as North America, Europe, Japan, Korea, Singapore and China. FLEX Taiwan provides a powerful platform for connecting with customers, suppliers, future partners, researchers and academia to drive collaboration and uncover new opportunities.

About SEMI
SEMI? connects?more than 2,100?member companies and 1.3 million?professionals worldwide?to?advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more?powerful, and more affordable electronic products.?Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA)?and the?MEMS?& Sensors Industry Group (MSIG) are SEMI Strategic Association Partners,?defined communities within?SEMI?focused on specific technologies. Visit learn more, contact one of our worldwide offices, and connect with SEMI on?LinkedIn?and?Twitter.


Press Contacts
Emmy Yi, SEMI Taiwan
Jamie Liao, SEMI Taiwan